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無鹵助焊膏

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產品名稱: 無鹵助焊膏
產品型號: NC-669-LF
產品展商: 其它品牌
產品文檔: 無相關文檔

簡單介紹

無鹵助焊膏NC-669-LF is an RoHS-compliant lead-free, no-clean solder paste that delivers improved solderability with all Pb-Free metallization, including ENIG (Gold)


無鹵助焊膏  的詳細介紹
無鹵助焊膏

NC-669-LF is an RoHS-compliant lead-free, no-clean solder paste that delivers improved solderability with all Pb-Free metallization, including ENIG (Gold), OSP, HASL and immersion silver boards. NC-560-LF increases production yields with its unparalleled lot-to-lot and stencil printing consistency, and offers superior print performance characteristics, including excellent wetting, strong activity, ideal viscosity,
long stencil life, thermal stability up to 300°C, and minimal residue. NC-560-LF is also low beading, low voiding, and anti-tombstoning to reduce scrap and rework.

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